ID WORLD International Congress: Ronald C. Lasky

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Ronald C. Lasky

Senior Technologist – Indium Corporation

Speaks at ID WORLD on Sustainability

Ronald C. Lasky is currently an Instructional Professor at Dartmouth College and a Senior Technologist at Indium Corporation. Prior to these assignments, he had over thirty years experience in electronic and optoelectronic packaging and assembly at IBM, Universal Instruments and Cookson Electronics.

He has authored or edited 5 books on science, electronics, and optoelectronics and numerous technical papers and authored articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of the several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization. He is the co-creator of engineering certification exams in electronic assembly and the Director of Dartmouth’s Six Sigma Program. Ron was awarded the Surface Mount Technology Association’s Founder’s Award in 2003.

He owns four earned degrees, including a Ph.D. from Cornell University in Materials Science. Ron is also a licensed professional engineer.

“THE CHALLENGES AND BENEFITS OF LEAD-FREE ELECTRONIC ASSEMBLY”

It is common, for those involved in electronic assembly, to believe that using lead-free solder has only drawbacks. Examples of this perspective are that the melting temperature of SAC3XX solders being about 35oC higher than tin-lead solders, and the inability of lead-free solders to welt copper pads and leads as well as tin-lead solder. These factors, in addition to the belief that lead-free reliability is worse than tin-lead reliability and poorly understood, have continued to foster the conviction that assembling with lead-free solder has only downsides.

This paper will challenge these beliefs. We will show that due to lead-free solder’s poor wetting, closer spacings between PWB pads are possible, enabling increased miniaturization. In a sense, modern portable electronic devices such as smartphones and personal music players could not be assembled with tin-lead solder, the close PWB pads would short under tin-lead solder’s better wetting.

In addition, a thorough review of lead-free solder joint reliability, including field data will also be presented. Both thermal cycle and drop shock data will be discussed. These data will suggest that lead-free reliability for consumer products, is equal or better than tin-lead solder joint reliability.

The paper will conclude by listing the challenges and advantages of lead-free solder in comparison to tin-lead solder.

 

Speaking on November 3


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